Our DC/DC converters use an encapsulated design with internal potting to enhance insulation and thermal performance.

Because potting compounds are porous and hygroscopic, there is a risk that cleaning agents may be absorbed during the cleaning process and retained within the product, which can affect long-term reliability.

Cleaning results can vary significantly with the equipment, process parameters (e.g., temperature settings, cycle/dwell time, vibration method) and the cleaning agent’s formulation.

For these reasons, cleaning or ultrasonic process is generally not recommended unless demonstrably necessary in the manufacturing process.

Potential issues include, but are not limited to:

• Long-term material degradation caused by residual cleaning agents.
• Moisture or ionic residues may reduce insulation resistance, potentially leading to increased leakage current or dielectric breakdown.
• Inappropriate cleaning agents or residual chemicals may accelerate corrosion of solder joints and terminals.
• Structural damage such as cracking or delamination of potting compounds, enclosure/housing, or protective coatings.
• Fading or loss of product markings, lot/date codes, or surface finishes following exposure to cleaning agents.
• Latent failures resulting from incomplete drying and moisture retained within the product.

In light of the above risks, avoid cleaning process whenever possible.

If cleaning process is required, customers should thoroughly validate the process under their own manufacturing conditions and in the intended application environment, and acknowledge and assume any associated risks and responsibilities.

P-DUKE Technology Co., Ltd.

Leo Liu

QA Dept. Vice Director

Oct. 23, 2025

Cleaning Process Advisory